CDIL Semiconductor will add new assembly lines, increase capacity by 10 crore units – Dainik Savera Times
New Delhi: CDIL Semiconductors (Continental Devices India) said it will add new semiconductor packaging lines through the SPECS scheme of the Ministry of Electronics and Information Technology. Semiconductor chips and component makers want to increase annual capacity to 100 million units through new lines.
According to a press release issued by the company, it has started the first phase of this production with a surface-mount packaging line of 50 million devices. Minister of State for Electronics and IT Rajiv Chandrashekhar will inaugurate it on September 28. According to the release, “CDIL Semiconductor (Continental Device India)…will add new semiconductor packaging lines through the Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) of the Government of India and the Ministry of Electronics and Information Technology.
According to the release, CDIL aims to expand its annual capacity to 100 million units with the new lines. CDIL is a semiconductor and electronics service provider to a global customer base in the consumer, industrial, defence, aerospace and automotive industries. According to the release, the company’s customers are spread across the US, UK, Germany, China, Hong Kong, Japan, South Korea, South Africa and Egypt.
