PM Modi lays the foundation stone of three semiconductor projects costing about Rs 1.25 lakh crore
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Semi Conductor Project: Prime Minister Narendra Modi will participate in ‘India’s Teched: Chips for Developed India’ through video conference on Wednesday and laid the foundation stone of three semiconductor projects worth about Rs 1.25 lakh crore. The PMO said that the Prime Minister’s vision is to establish India as a global center for semiconductor design, manufacturing and technology development, so as to promote employment opportunities for the youth of the country.
For your information, let us tell you that according to this concept, semiconductor fabrication facility is being constructed in Dholera Special Investment Region (DSIR), Gujarat, Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam and Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat. Foundation stone is being laid for OSAT) facility.
Under the revised scheme for setting up semiconductor fabs in India, the semiconductor fabrication facility in Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL). This will be the country’s first commercial semiconductor fab with a total investment of Rs 91,000 crore.
The PMO further said, “Through these facilities, the semiconductor eco-system will be strengthened and its roots will be strengthened in India. These units will provide employment to thousands of youth in the semiconductor industry and will also promote employment generation in related sectors like electronics, telecommunication etc.
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