When will the first Made in India chip arrive?

Made in India Chip: Union Communications and Information Technology Minister Ashwini Vaishnav has said that semiconductor production from Tata Electronics’ Dholera plant will start from December 2026. Addressing the foundation stone laying ceremony of Tata Group and CG Power chip plants, Vaishnav said India will be among the top five chip making hubs in the world by 2029. The minister said, the first chip from the Dholera plant will arrive in December 2026 and the chip from the Micron plant will arrive by December 2024. He said that Tata’s Dholera plant will make chips in 28, 50, 55 nanometer nodes.

Prime Minister Narendra Modi laid the foundation stone of three chip plants on Wednesday. Of these, two units are of Tata Electronics and the third is of CG Power. There will be a total investment of Rs 1.26 lakh crore in this. These three plants include Tata Electronics’ country’s first high-tech chip manufacturing plant, which the company is setting up in partnership with Taiwan’s Powerchip Semiconductor Manufacturing Corp. in the special industrial area of ​​Dholera.

Semiconductor chips will be made in India, Tata Group will also set up a plant, this is the government’s plan

The plant will have a capacity to produce 50,000 wafers per month and will involve an investment of Rs 91,000 crore. The Center will contribute 50 percent of the capital expenditure on equal basis. Powered by advanced technology, these chips will meet the needs of multiple sectors – electric vehicles (EV), telecom, defence, vehicles, consumer electronics, displays and power electronics.

Semiconductor is a fundamental industry that touches almost every aspect of life. It is used in everything from refrigerators to ACs, cars, planes and trains. The Prime Minister also laid the foundation stone for another new assembly and testing facility of Tata Electronics at Jagiroad in Assam.

Tata’s Assam plant will be constructed with an investment of Rs 27,000 crore and will create more than 27,000 direct and indirect employment opportunities in the region. This will be India’s first semiconductor unit in the Northeast. Tata Semiconductor Assembly and Test (TSAT) will develop indigenous advanced semiconductor packaging technologies including flip chip and ISIP (Integrated System in Package) technologies with a capacity of 4.8 chips per day.

According to PTI – Bhasha report, the target segments for these will be automotive, electric vehicles, consumer electronics, telecom and mobile phones and others. The Prime Minister also laid the foundation stone for CG Power’s semiconductor unit, which it is setting up in partnership with Renesas Electronics Corp and Thailand’s Stars Microelectronics in Sanand, Gujarat, with an investment of Rs 7,600 crore.