Samsung opens new research lab for next generation 3D DRAM development
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soul (Uttam Hindu News): Samsung, the world’s largest memory chip maker, has set up a new research lab in the United States to focus on developing next-generation three-dimensional (3D) DRAM.
According to sources, the new lab is working under Device Solutions America (DSA), headquartered in Silicon Valley, which oversees Samsung’s semiconductor production in the US, and aims to help Samsung lead the global 3D memory chip market. Work will be done to develop an upgraded DRAM model to allow this.
In October, the South Korean tech giant said it was designing new 3D structures for sub-10-nanometer DRAM, which could lead to larger single-chip capacities exceeding 100 gigabits, news agency Yonhap reported.
Samsung succeeded in commercializing 3D vertical NAND flash memory chips for the first time in the industry in 2013.
Meanwhile, global semiconductor industry revenue is projected to decline 8.8 percent in 2023 due to a slowdown in enterprise and consumer spending.
According to Counterpoint Research, AI provided positive news to the semiconductor industry, emerging as a key content and revenue driver, especially in the second half of the year.
Samsung was affected by the slowdown in the memory market in both DRAM and NAND segments, which led to a 38 percent decline in its revenue. The memory market was primarily impacted by demand in the PC, server and smartphone segments as well as oversupply and excess inventory across the market.
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